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Composite Copper Clad Laminates CEM-3 ELC-4970 Series
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作者 Hiroshi HAYAI Keiji Azuma Takahisa IIDA 《印制电路信息》 2001年第2期22-25,共4页
“Composite Copper Clad Lamilnates CEM-3 ElC-4970 Series”和“Build-up Materials APL Series”两文是日本住友电木株式会社的早井宙先生(负责开发CEM-3系列的工程师)用英文撰写的有关CEM-3文章,为尊重本人著作起见,现不作翻译,将... “Composite Copper Clad Lamilnates CEM-3 ElC-4970 Series”和“Build-up Materials APL Series”两文是日本住友电木株式会社的早井宙先生(负责开发CEM-3系列的工程师)用英文撰写的有关CEM-3文章,为尊重本人著作起见,现不作翻译,将原文刊出。 展开更多
关键词 CEM-3 ELC-4970 覆铜板 印刷电路
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Build-up Materials APL Series
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作者 Hiroshi HAYAI Takamasa AKAMATSU Toshio KOMIYATANI 《印制电路信息》 2001年第2期26-30,共5页
In recent years the high efficiency of small and light weight electronic devices has been progressing and the multilayer printed wiring board in connection with this have been progressing as well, becoming many pins o... In recent years the high efficiency of small and light weight electronic devices has been progressing and the multilayer printed wiring board in connection with this have been progressing as well, becoming many pins or a narrow pitch. The build-up board, which makes high-density and narrow pitch possible, is basking in the limelight of this progression trend. (Fig 1) Now, many methods of construction of these build-up boards is advocat- 展开更多
关键词 印刷电路板 复合村料 APL系列
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