Interfacial Characterization and Mechanical Property of Ti/Cu Clad Sheet Produced by Explosive Welding and Annealing

It was aim to investigate the interfacial microstructure and shear performance of Ti/Cu clad sheet produced by explosive welding and annealing. The experimental results demonstrate that the alternate distribution of interfacial collision and vortex of flyer layer forms in the interface a few of solidification structure. TEM confirms that the interfacial interlayer contains obvious lattice distortion structure and intermetallic compounds. It interprets the explosive welding as the interfacial deformation and thermal diffusion process between dissimilar metals. The interfacial shear strength is very close to the Cu matrix strength, which is determined by the mixture of the mechanical bonding and metallurgical bonding. Several cracks exist on the shear fracture owing to the intermetallic compound in the interfacial solidifi cation structure and also the probable welding inclusion.

Effect of Magnesium and Cerium Microelement on Microstructures and Mechanical Properties of K465 Nickel-Base Superalloy

0.02%(mass fraction) Mg and 0.02% Ce were added into nickel-base superalloy, K465, in order to study their effect on microstructures and mechanical properties. The results showed that without addition of Mg and Ce, the grain boundaries was flat, the MC carbide precipitate was noncontinuous with particle shape. With 0.02% Mg addition the MC carbide tended to have tiny granular and blocky morphology, while it had a cursive script-like morphology with 0.02% Ce addition. It was also shown that without any addition of Mg and Ce, the room temperature properties, average tensile strength (σb) and yield strength (σ0.2) were 960 and 790 MPa, the creep rupture life under the condition of 1248 K, 230 MPa was 28.1 h. With the addition of 0.02% Mg, the room temperature properties, average tensile strength and yield strength had a certain enhancement, the creep rupture life (1248 K, 230 MPa) was up to 66.7 h. When the Ce addition was 0.02%, average tensile strength and yield strength were up to 1020～1030 MPa and 855～885 MPa, respectively, but the average elongation percentage fell down to 3.0%, only reaching the required value. The most expressive thing was that the creep rupture life (1248 K, 230 MPa) was only 17.25～18.77 h, far below the required value.

Preparation and Characterization of Graphite Powder Covered with CeO_2

In order to improve the wetting properties of graphite with Al melt and reduce the oxidation of the graphite, by which the segregation of components during the liquid-stir-casting process could be prevented. In this paper, a uniform thin nano-film of CeO2, about 20 nm thick, was successfully prepared onto graphite powder surface by heterogeneous nucleation process. The results show that an obvious chemical reaction did exit between CeO2 film and graphite with the formation of Ce-O-C bond, leading to a shift of the binding energy of C and Ce. The cover with CeO2 film illustrates a distinct change of surface state of graphite with a decrease of angle of contact.

Mechanical properties of UHMWPE/Sm_2O_3 composite shielding material

UHMWPE have good effect to slow down fast neutrons and Sm2O3 can absorb the thermal neutrons.A new style UHMWPE/ Sm2O3 composite shielding material was manufractured by hot-press moulding method.The microstructure and mechanical properties were characterized by IR and SEM.The results indicate that Sm2O3 distributed continuously,evenly in UHMWPE,and the interface was combined closely.Hardness of UHMWPE/Sm2O3 composites increased at first and decreased and tensile strength decreased with the increasing of Sm2O3 mass fraction.

Growth kinetics of titanium boride layers on the surface of Ti6Al4V

Dual titanium boride layers consisting of continuous TiB2 top-layer and TiB whisker sublayer were formed on the surface of Ti6Al4V alloy using powder-pack boriding technique. An iso-thickness diagram of the whole boride layer was fitted with the data of thickness of the coating, treatment time and process temperature using Sigma Plot10.0 software. Growth kinetics of the titanium boride layer were analyzed by measuring the extent of penetration of TiB2 and TiB whisker as a function of boriding time in the range of 5-20 h and boriding temperature in the range of 1000-1100 ℃. By the linear regression analysis of growth kinetics of titanium boride layer, the diffusivity K and average diffusion activation energy (Q) of boron atoms in Ti6Al4V alloy were calculated, respectively.