This study delves into ion behavior at the substrate position within RF magnetron discharges utilizing an indium tin oxide(ITO)target.The positive ion energies exhibit an upward trajectory with increasing RF power,att...This study delves into ion behavior at the substrate position within RF magnetron discharges utilizing an indium tin oxide(ITO)target.The positive ion energies exhibit an upward trajectory with increasing RF power,attributed to heightened plasma potential and initial emergent energy.Simultaneously,the positive ion flux escalates owing to amplified sputtering rates and electron density.Conversely,negative ions exhibit broad ion energy distribution functions(IEDFs)characterized by multiple peaks.These patterns are clarified by a combination of radiofrequency oscillation of cathode voltage and plasma potential,alongside ion transport time.This elucidation finds validation in a one-dimensional model encompassing the initial ion energy.At higher RF power,negative ions surpassing 100 e V escalate in both flux and energy,posing a potential risk of sputtering damages to ITO layers.展开更多
Crystalline silicon(c-Si)heterojunction(HJT)solar cells are one of the promising technologies for next-generation industrial high-efficiency silicon solar cells,and many efforts in transferring this technology to high...Crystalline silicon(c-Si)heterojunction(HJT)solar cells are one of the promising technologies for next-generation industrial high-efficiency silicon solar cells,and many efforts in transferring this technology to high-volume manufacturing in the photovoltaic(PV)industry are currently ongoing.Metallization is of vital importance to the PV performance and long-term reliability of HJT solar cells.In this review,we summarize the development status of metallization approaches for highefficiency HJT solar cells.For conventional screen printing technology,to avoid the degradation of the passivation properties of the amorphous silicon layer,a low-temperature-cured(<250℃)paste and process are needed.This process,in turn,leads to high line/contact resistances and high paste costs.To improve the conductivity of electrodes and reduce the metallization cost,multi-busbar,fine-line printing,and low-temperature-cured silver-coated copper pastes have been developed.In addition,several potential metallization technologies for HJT solar cells,such as the Smart Wire Contacting Technology,pattern transfer printing,inkjet/FlexTrailprinting,and copper electroplating,are discussed in detail.B ased on the summary,the potential and challenges of these metallization technologies for HJT solar cells are analyzed.展开更多
基金financial supports by National Natural Science Foundation of China(Nos.11975163 and 12175160)Nantong Basic Science Research-General Program(No.JC22022034)Natural Science Research Fund of Jiangsu College of Engineering and Technology(No.GYKY/2023/2)。
文摘This study delves into ion behavior at the substrate position within RF magnetron discharges utilizing an indium tin oxide(ITO)target.The positive ion energies exhibit an upward trajectory with increasing RF power,attributed to heightened plasma potential and initial emergent energy.Simultaneously,the positive ion flux escalates owing to amplified sputtering rates and electron density.Conversely,negative ions exhibit broad ion energy distribution functions(IEDFs)characterized by multiple peaks.These patterns are clarified by a combination of radiofrequency oscillation of cathode voltage and plasma potential,alongside ion transport time.This elucidation finds validation in a one-dimensional model encompassing the initial ion energy.At higher RF power,negative ions surpassing 100 e V escalate in both flux and energy,posing a potential risk of sputtering damages to ITO layers.
基金supported by the Priority Academic Program Development of Jiangsu Higher Education Institutions(PAPD)。
文摘Crystalline silicon(c-Si)heterojunction(HJT)solar cells are one of the promising technologies for next-generation industrial high-efficiency silicon solar cells,and many efforts in transferring this technology to high-volume manufacturing in the photovoltaic(PV)industry are currently ongoing.Metallization is of vital importance to the PV performance and long-term reliability of HJT solar cells.In this review,we summarize the development status of metallization approaches for highefficiency HJT solar cells.For conventional screen printing technology,to avoid the degradation of the passivation properties of the amorphous silicon layer,a low-temperature-cured(<250℃)paste and process are needed.This process,in turn,leads to high line/contact resistances and high paste costs.To improve the conductivity of electrodes and reduce the metallization cost,multi-busbar,fine-line printing,and low-temperature-cured silver-coated copper pastes have been developed.In addition,several potential metallization technologies for HJT solar cells,such as the Smart Wire Contacting Technology,pattern transfer printing,inkjet/FlexTrailprinting,and copper electroplating,are discussed in detail.B ased on the summary,the potential and challenges of these metallization technologies for HJT solar cells are analyzed.
