A lateral AlGaN/GaN Schottky barrier diode with 0.36-V turn-on voltage and 10-kV breakdown voltage by using double-barrier anode structure

GaN power electronic devices,such as the lateral AlGaN/GaN Schottky barrier diode(SBD),have received significant attention in recent years.Many studies have focused on optimizing the breakdown voltage(BV)of the device,with a particular emphasis on achieving ultra-high-voltage(UHV,>10 kV)applications.However,another important question arises:can the device maintain a BV of 10 kV while having a low turn-on voltage(V_(on))?In this study,the fabrication of UHV AlGaN/GaN SBDs was demonstrated on sapphire with a BV exceeding 10 kV.Moreover,by utilizing a doublebarrier anode(DBA)structure consisting of platinum(Pt)and tantalum(Ta),a remarkably low Von of 0.36 V was achieved.This achievement highlights the great potential of these devices for UHV applications.

Negative transconductance effect in p-GaN gate AlGaN/GaN HEMTs by traps in unintentionally doped GaN buffer layer

We investigate the negative transconductance effect in p-GaN gate AlGaN/GaN high-electron-mobility transistor(HEMT) associated with traps in the unintentionally doped GaN buffer layer. We find that a negative transconductance effect occurs with increasing the trap concentration and capture cross section when calculating transfer characteristics.The electron tunneling through AlGaN barrier and the reduced electric field discrepancy between drain side and gate side induced by traps are reasonably explained by analyzing the band diagrams, output characteristics, and the electric field strength of the channel of the devices under different trap concentrations and capture cross sections.