The objective of this work is to analyze the transient effects of ^60Co gamma rays in the CMOS image sensor (CIS) using the Monte Carlo method, based on Geant4. The track, energy spectrum, and angle of produced electr...The objective of this work is to analyze the transient effects of ^60Co gamma rays in the CMOS image sensor (CIS) using the Monte Carlo method, based on Geant4. The track, energy spectrum, and angle of produced electrons when gamma rays traversed a silicon or silicon dioxide cube were calculated. A simplified model of a 500 × 500 CIS array was established, and the transient effects of gamma rays in the CIS were simulated. The raw images were captured when the CIS was irradiated by gamma rays. The experimental results were compared with the simulation results. The characteristics of the typical events induced by transient effects were analyzed.展开更多
Radiation induced offstate leakage in the shallow trench isolation regions of SIMC 0.18 μm nMOSFETs is studied as a function of dose rate. A ＂true＂ dose rate effect （TDRE） is observed. Increased damage is observe...Radiation induced offstate leakage in the shallow trench isolation regions of SIMC 0.18 μm nMOSFETs is studied as a function of dose rate. A ＂true＂ dose rate effect （TDRE） is observed. Increased damage is observed at low dose rate （LDR） than at high dose rate （HDR） when annealing is taken into account. A new method of simulating radiation induced degradation in shallow trench isolation （STI） is presented. A comparison of radiation induced offstate leakage current in test nMOSFETs between total dose irradiation experiments and simulation results exhibits excellent agreement. The investigation results imply that the enhancement of the leakage current may be worse for the dose rate encountered in the environment of space.展开更多
In this paper, total ionizing dose effect of NMOS transistors in advanced CMOS technology are exam- ined. The radiation tests are performed at 60Co sources at the dose rate of 50 rad （Si）/s. The investigation＇s res...In this paper, total ionizing dose effect of NMOS transistors in advanced CMOS technology are exam- ined. The radiation tests are performed at 60Co sources at the dose rate of 50 rad （Si）/s. The investigation＇s results show that the radiation-induced charge buildup in the gate oxide can be ignored, and the field oxide isolation struc- ture is the main total dose problem. The total ionizing dose （TID） radiation effects of field oxide parasitic transistors are studied in detail. An analytical model of radiation defect charge induced by TID damage in field oxide is estab- lished. The I-V characteristics of the NMOS parasitic transistors at different doses are modeled by using a surface potential method. The modeling method is verified by the experimental I V characteristics of 180 nm commer- cial NMOS device induced by TID radiation at different doses. The model results are in good agreement with the radiation experimental results, which shows the analytical model can accurately predict the radiation response characteristics of advanced bulk CMOS technology device.展开更多
基金supported by the National Natural Science Foundation of China(Nos.11805155,11875223,and 11690043)the Chinese Academy of Sciences strategic pilot science and technology project(No.XDA15015000)+1 种基金the Innovation Foundation of Radiation Application(No.KFZC2018040201)the Foundation of State Key Laboratory of China(Nos.SKLIPR1803 and 1610)
文摘The objective of this work is to analyze the transient effects of ^60Co gamma rays in the CMOS image sensor (CIS) using the Monte Carlo method, based on Geant4. The track, energy spectrum, and angle of produced electrons when gamma rays traversed a silicon or silicon dioxide cube were calculated. A simplified model of a 500 × 500 CIS array was established, and the transient effects of gamma rays in the CIS were simulated. The raw images were captured when the CIS was irradiated by gamma rays. The experimental results were compared with the simulation results. The characteristics of the typical events induced by transient effects were analyzed.
基金Supported by National Science Foundation of China(11305126)
文摘Radiation induced offstate leakage in the shallow trench isolation regions of SIMC 0.18 μm nMOSFETs is studied as a function of dose rate. A ＂true＂ dose rate effect （TDRE） is observed. Increased damage is observed at low dose rate （LDR） than at high dose rate （HDR） when annealing is taken into account. A new method of simulating radiation induced degradation in shallow trench isolation （STI） is presented. A comparison of radiation induced offstate leakage current in test nMOSFETs between total dose irradiation experiments and simulation results exhibits excellent agreement. The investigation results imply that the enhancement of the leakage current may be worse for the dose rate encountered in the environment of space.
基金Project supported by the National Natural Science Foundation of China(No.11305126)
文摘In this paper, total ionizing dose effect of NMOS transistors in advanced CMOS technology are exam- ined. The radiation tests are performed at 60Co sources at the dose rate of 50 rad （Si）/s. The investigation＇s results show that the radiation-induced charge buildup in the gate oxide can be ignored, and the field oxide isolation struc- ture is the main total dose problem. The total ionizing dose （TID） radiation effects of field oxide parasitic transistors are studied in detail. An analytical model of radiation defect charge induced by TID damage in field oxide is estab- lished. The I-V characteristics of the NMOS parasitic transistors at different doses are modeled by using a surface potential method. The modeling method is verified by the experimental I V characteristics of 180 nm commer- cial NMOS device induced by TID radiation at different doses. The model results are in good agreement with the radiation experimental results, which shows the analytical model can accurately predict the radiation response characteristics of advanced bulk CMOS technology device.
