The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered p...The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.展开更多
当LTE（Long Term Evolution，长期演进技术）的部署气势重新抬头，企业经营者与手机制造商都该明白，4G网络并非3G性能萎靡不振时的万灵丹。事实上，大家必须了解，完整的LTE解决方案包括了提升速度与可靠度，以及一系列持续强化处理...当LTE（Long Term Evolution，长期演进技术）的部署气势重新抬头，企业经营者与手机制造商都该明白，4G网络并非3G性能萎靡不振时的万灵丹。事实上，大家必须了解，完整的LTE解决方案包括了提升速度与可靠度，以及一系列持续强化处理，以避免因网络流量过大、数据使用量增加．还有外形尺寸限制等因素而造成的拥塞。展开更多
文摘The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.
文摘当LTE（Long Term Evolution，长期演进技术）的部署气势重新抬头，企业经营者与手机制造商都该明白，4G网络并非3G性能萎靡不振时的万灵丹。事实上，大家必须了解，完整的LTE解决方案包括了提升速度与可靠度，以及一系列持续强化处理，以避免因网络流量过大、数据使用量增加．还有外形尺寸限制等因素而造成的拥塞。
